Visual Inspection
This includes the microscopic examination of all component surfaces as well as the digital measurement for dimensional accuracy.
First, we conduct a thorough examination of the entire shipment, including individual components. This involves verifying the count of items, assessing packaging condition, reviewing documents and labels, ensuring the packaging type complies with ESD & MSL standards, and checking date and lot codes. Initial anomalies can be detected already at this stage.
Next, using a stereo light microscope, our experts carefully examine the device package and leads of each component in the test lot. This examination checks for accurate part markings, correct placement of the pin-1 indicator, and pin geometry. Additionally, we assess packages for tampering and inspect component leads for oxidation, contamination, and any reworking, including re-tinning.
To match the critical parameters of component geometry and angular lead dimensions with the datasheet, we utilize a digital microscope with a measurement function. This includes verifying coplanarity. The results are documented with high-resolution images that incorporate the dimensions, thus providing clear and detailed insights.
Having reference samples from reliable sources of the components to be tested is crucial at this stage. This allows for the conclusive assessment of characteristics that are either borderline or not specified in the datasheet through direct comparison.
